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Snapdragon 8s Gen 3 vs Dimensity 7050

We have analyzed two 8-core mobile processors: Qualcomm Snapdragon 8s Gen 3 and MediaTek Dimensity 7050. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 8s Gen 3
SM8650
Dimensity 7050
Announced March 18, 2024 May 2, 2023

CPU & GPU

CPU 1x Cortex-X4 @ 3.0 GHz
4x Cortex-A720 @ 2.8 GHz
3x Cortex-A520 @ 2.0 GHz
2x Cortex-A78 @ 2.6 GHz
6x Cortex-A55 @ 2 GHz
GPU Adreno 700 @ 1100 MHz Arm Mali-G68 MP4 @ 800 MHz
Process 4nm TSMC 6nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 200MP 1x 200MP

RAM & Storage

RAM Type LPDDR5X up to 24 GB LPDDR5 up to 16 GB
RAM Frequency 4200 MHz 2750 Mhz
Storage Type UFS 4.0 UFS 3.1
UFS 2.1

Display

Resolution 3840 x 2160 2520 x 1080
Display Type HDR Vivid, HDR10, HDR10+ Full HD+ @ 120Hz Refresh rate

AnTuTu

Score 1554839 502001

Geekbench

Single core 2019 840
Multi core 5570 2300

Network

5G Support
Modem Snapdragon X70 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA

Additional Features

AI Qualcomm Hexagon NPU MediaTek APU 550
Charging Qualcomm Quick Charge 5 technology Fast charging support
Bluetooth 5.4 5.2
Wi-Fi 7 6 (a/b/g/n/ac/ax)
NFC
GPS
FM Radio
  Qualcomm Snapdragon 8s Gen 3 MediaTek Dimensity 7050