MediaTek Dimensity 8000

The MediaTek Dimensity 8000 is an 8-core chipset announced on March 1, 2022, utilizing advanced 5-nanometer process technology. This high-performance SoC features a powerful CPU configuration with 4 Cortex-A78 cores clocked at 2.75 GHz and 4 Cortex-A55 cores clocked at 2.0 GHz, providing an optimal balance of speed and energy efficiency.

Designed for premium mid-range smartphones, the Dimensity 8000 integrates a Mali-G610 MC6 GPU, delivering exceptional graphics performance for demanding gaming and multimedia applications. The chipset supports advanced AI capabilities through MediaTek’s APU (AI Processing Unit), enhancing various AI-driven features such as camera enhancements, real-time video processing, and intelligent device interactions.

The Dimensity 8000 includes comprehensive 5G support, offering fast data speeds, low latency, and reliable connectivity with support for both standalone (SA) and non-standalone (NSA) 5G networks. It also supports Wi-Fi 6 and Bluetooth 5.2, ensuring robust wireless connectivity options.

For camera enthusiasts, the chipset supports high-resolution camera sensors and advanced imaging features, including 4K video recording, multi-camera setups, and improved low-light performance. It also includes MediaTek’s HyperEngine 5.0 technology, optimizing gaming performance by enhancing network connectivity, CPU and GPU performance, and resource management for a smoother and more responsive gaming experience.

Overall, the MediaTek Dimensity 8000 is designed to deliver a premium mobile experience with its powerful processing capabilities, advanced graphics, and comprehensive connectivity options, making it an ideal choice for high-performance mid-range smartphones.

SPECIFICATIONS