Unisoc Tanggula T760

The Unisoc Tanggula T760 is a high-performance SoC designed to deliver strong performance and advanced features for smartphones and tablets. Announced in 2021, it is built using a 6-nanometer process technology, ensuring superior power efficiency and robust performance for a variety of mobile applications.

The Tanggula T760 features an octa-core CPU configuration with a combination of four high-performance ARM Cortex-A76 cores clocked at up to 2.5 GHz and four power-efficient ARM Cortex-A55 cores running at up to 2.0 GHz. This setup provides exceptional performance for demanding tasks while maintaining energy efficiency for everyday activities and multitasking.

For graphics, the Tanggula T760 integrates the ARM Mali-G57 MC4 GPU, delivering excellent performance for gaming and high-definition multimedia applications. The GPU supports advanced graphics APIs and high frame rates, ensuring a smooth and immersive visual experience.

AI capabilities are significantly enhanced with Unisoc’s AI Processing Unit (APU), which supports a wide range of AI applications such as real-time image processing, facial recognition, and intelligent camera features, improving the overall responsiveness and intelligence of the device.

The Unisoc Tanggula T760 powers several high-performance devices, including some models from Honor and Hisense. Overall, the Tanggula T760 combines powerful performance, advanced AI and imaging capabilities, and cutting-edge 5G connectivity, making it an excellent choice for high-end smartphones and tablets. It provides a seamless and responsive user experience across a wide range of applications, from everyday tasks to high-end gaming and multimedia consumption.

SPECIFICATIONS